| Solar cell laser etching system |
@Reversal Mechanism
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It was designed, applying the technology and knowledge and know-how which were cultivated by ITO dry etching equipment and other machines.
It is equipment which performs a patterning of the emulsion side of the topmost part of multilayer of Solar cell (Thin Film and CIGS) by laser.
Except the laser oscillation machine, all designs and manufactures are performed by our company. Therefore, manufacturing the equipment which our customers just want is possible. Since the stone surface plate is used for equipment, patterning in the }20Κm of comprehensive processing accuracy is possible (in case of only machinery part, it is }5Κm). And the pattern created using AUTO CAD adjusts 8 optical path pitches automatically by only transmitting a file to equipment. Moreover, in order to avoid useless tact time, the fastest patterning is automatically calculated by software.
Since DEMO equipment is prepared, please feel free to contact us about
sample processing etc.@@@@@@@@@@ |
EIn order to correspond to the tact time which a customer wants, the 16-scribings are simultaneously possible at the maximum.
EAbout the laser to be used, since laser with short pulse width is used, the quality of processed goods is good.
ESince the reversal mechanism is installed into right side and left side,
it can be used by In-Line. Therefore, it is safe and saves personnel expenses
etc.
EA drawing can be changed easily by CAD data. Moreover, since it is in-house software, operation is also easy.
EWhen changing a drawing, the pitch length between optical path can be automatically changed. Furthermore, when the thickness of a substrate is changed, a Z-axis value can be changed automatically.
| Substrate size |
1100mm x
1400mm (other orders are available) |
| Processing speed |
500-1000mm/s MAX @@@@Linear motor |
| The width of processing line |
30um -120um@@ (A prior test is done, because it is based on composition
of a substrate) |
| Laser wavelength |
1064nm or 532nm |
| Using data |
CAD data (dxf file) |
| Recognition of a position |
Automatic alignment by an image recognition system
(The recognition mark or end surface on a substrate is read at high speed, and it is rectified as w|x|¦) |
The example of reference: Patterning
*1. Since it changes with patterns, travel time is not included in the
example of the above-mentioned reference.
*2. In the patterning of reference, X-Y has been calculated with the same length (1400mm per line).
 @@@
This laser etching equipment has preinstalled the mechanism which easily adjusts the pitches between scribing automatically by operating a touch panel, connecting with in-house software.
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